Lyncee Tec MEMS全息測(cè)振分析儀

探索精彩的4D世界

全息MEMS測(cè)振分析儀記錄MEMS振動(dòng)周期中的三維形貌時(shí)序圖，為MEMS振動(dòng)測(cè)量提供了 的豐富數(shù)據(jù)，特別是可以在被測(cè)視場(chǎng)內(nèi)任意一點(diǎn)測(cè)量面內(nèi)和面外振幅（位移）及頻率響應(yīng)，這些獨(dú)特優(yōu)勢(shì)與完善的配套軟、硬件一起提供了一套完整的MEMS振動(dòng)測(cè)量解決方案。

• 非掃描式測(cè)量，大大縮短表征時(shí)間

• 使您能夠有效比較模擬仿真與實(shí)際器件測(cè)量結(jié)果

• 獨(dú)有的全息技術(shù)助您獲得其他測(cè)量技術(shù)無(wú)法實(shí)現(xiàn)的數(shù)據(jù)

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實(shí)時(shí)呈現(xiàn)器件響應(yīng)：

 

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With a single instrument

一套完整的解決方案：從測(cè)量 …

Lyncée Tec的全息MEMS測(cè)振儀擁有包括軟、硬件在內(nèi)的一整套完整的解決方案：

• 可加熱樣品探針臺(tái)

• 可溫控真空腔

• MEMS信號(hào)激勵(lì)，可達(dá) 25 MHz

• 記錄器件電學(xué)響應(yīng)

• DHM? 記錄三維形貌時(shí)序圖

• 頻閃模塊同步測(cè)量信號(hào)

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… 到時(shí)序圖分析

MEMS專用分析軟件MEMSAnalysis Tool 能夠?qū)崿F(xiàn)高效的三維時(shí)序圖分析：

• 離面運(yùn)動(dòng)測(cè)量幅值從 5 pm 至 50 microns

• 面內(nèi)運(yùn)動(dòng)測(cè)量幅值從 1 nm (子像素算法) 至 5 mm

• 伯德和傅里葉頻域分析

• 多器件振動(dòng)測(cè)繪、模態(tài)圖

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用戶反饋

Users Testimonials

University Autonome of Barcelona

An international team of researchers from Spain, the Netherlands, and USA have characterized the flexoelectric coefficient of dielectric materials on silicon by measuring the bending radius induced on application of voltage, with the DHM?.

Nature publication

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The DHM, unlike a vibrometer, directly measures the out of plane displacement induced at each point of a MEMS structure during a vibrational excitation .
Thus, the DHM data lends itself elegantly to harmonic analysis via the application of discrete Fourier transform techniques. The latter is indispensable to distinguish between a response that scales linearly with the applied electric field (for example, piezoelectric strains) and a response that scales quadratically with the applied electric field (for example, electrostictive strains).

FHG-IPMS in Dresden, and TU Cottbus Senftenberg

German researchers from FHG-IPMS in Dresden, and TU Cottbus Senftenberg have measured the deflection of a revolutionary micro-actuator technology using DHM? (IPMS-FHG press release).

Nature publication, Electronic Component News 

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We can work with any dynamics we want (stroboscopic and continuous measurement) – that makes the DMH unique to alternative tools (WLI and Laser-Doppler-Vibrometer).
It gives the high vertical resolution to precisely characterize the actuator out of plane deflection

A vibrometer measures a velocity using the Doppler effect: tip deflection is calculated by an integration. Consequently, position measurement errors are also integrated, preventing absolute prosition and long term drift measurements.
DHM? doesn’t suffer from this problem as it measures directly a position. Deflection can be measured accurately for any time scale.

系統(tǒng)構(gòu)成：

Holographic MEMS Analyzer

The Holographic MEMS Analyzer solution encompasses all the options to provide you with a complete environment for MEMS characterization. The system responds to most users characterization needs, however if something is missing, Lyncée Tec is also pleased to provide you with turnkey customized solutions.

Probing

MEMS probing platforms enable direct DHM? characterization of devices without wire-bonding. A heated version enables the investigation of the effects on MEMS responses of temperatures up to 200°C.

Vacuum and temperature control

Vacuum & thermal chambers enable characterization of devices in real conditions of use, e.g. vacuum, liquids, gas, high and low temperature, down to 196°C, high pressure, etc. Measurements are as simple as in ambient conditions thanks to DHM? unique optical configuration.

Holographic Microscopes

Reflection and transmission DHM? with one and two wavelengths are fully compatible with the Holographic  MEMS Analyzer solution. They can be configured with any objective, including long working distances, immersion, and glass corrected models, for measuring in presence of probes, in liquid, and through transparent covers respectively.

Stroboscopic Module

The stroboscopic unit synchronizes the MEMS excitation with the 3D  topography time sequence and electrical response measurements. is recorded to get 3D topographies time sequences along the excitation of the MEMS, vibration and electrical information in a single data set with one system.

Post-analysis software

The MEMS Analysis Tool software enables movement decomposition in terms of tilt, deformation, in- and out-of-plane displacements. Vibration amplitude, speed and acceleration at any location of the sample can then be calculated. Moreover, this software enables resonance, Fourier, and Bode frequency analysis.

Competitive strengths

Holographic MEMS Analyzer overcomes limitations of  usual MEMS analyzers.  It is the only solution able to synchronize MEMS excitation and 3D topography measurement at frequencies up to 25 MHz. Moreover, it is ideal to measure in any environmental condition.

Alternative systems are :

• Laser Doppler Vibrometer : LDV

• White Light Interferometer : WLI

• 2D stroboscopic microscopy

Holographic MEMS Analyzer vs Laser Doppler Vibrometer (LDV & 3D LDV)

The main difference between both systems is that the DHM? retrieves simultaneously data points on each pixel on the entire field of view while LDV scans the surface point by point.
Therefore LDV lateral resolution is limited by the spot size (few microns). With DHM? you can select the lateral resolution adapted to your sample by choosing the appropriated objective.
LDV has to perform a complex chain of signal processing steps to measure a velocity. Each data point is then converted in term of vibration amplitude. LDV alone does not provide an absolute position and thus no 3D topography. DHM? measures a time sequence of successive 3D topographies what enables direct calculation of absolute position, speed and acceleration. Vibrations amplitude can be determine with high reliability by DHM?.

Features	DHM?	3D LDV	LDV
Dynamic topography	√	×	×
3D vibrations (X,Y,Z)	XYZ	XYZ	Z only
Maximum frequency	25 MHz	25 MHz	up to 1.2 GHz
Full field measurement	√	with XY scanning	with XY scanning
Diffraction limited resolution	√	limited by laser spot size	limited by laser spot size
Objective turret	√	×	×
No need of sample preparation	√	–	? ×
Measurement of complex structures	√	×	×
Measurement of complex motions (simultaneous in-, out- of plane, tilt, … )	++	–	–
Measurement of in-plane displacement lager than MEMS structures	√	×	×

 

Holographic MEMS Analyzer vs 2D Stroboscopic Microscopy

2D stroboscopic microscope is usually combined with LDV to add in-plane displacement measurement capabilities to vibrometer.

Features	DHM?	2D Stroboscopic Microscopy
3D topography	√	×
3D vibrations (X,Y,Z)	√	×
Maximum frequency	25 MHz	1 MHz
Full field measurement	√	×

1. Only X,Y vibrations

Holographic MEMS Analyzer vs White Light Interferometer (WLI)

Some white light interferometers can perform a stroboscopic acquisition to measure MEMS dynamic topography. However, measurements of dynamic sample with a scanning technology are sensitive to environmental noise, i.e. vibrations, and are time consuming.

Some systems combine white light interferometer with LDV or 2D stroboscopic acquisition in order to measure a static topography. In this case measurements of topography in environmental chamber face usual limitations of WLI technology.

Features	DHM?	WLI
Dynamic topography	√	×
3D vibrations (X,Y,Z)	√	×
Maximum frequency	25 MHz	1 MHz
Stitching measurement	√	not in stroboscopic mode
Measurement in environmental chamber	√	×

 

Specifications

Optical measurement unit	Reflection DHM? or Transmission DHM?
MEMS excitation unit	LyncéeTec stroboscopic module
XYZ stage	Manual or motorized stage
Software	Koala for acquisition and live analysis   MEMS Analysis Tool for advanced post-analysis
Objective	Turret with 6 positions, magnification from 2.5x to 100x
In-plane vibration2	from 10 nm to 5 mm
Out-of-plane vibrations2	from 10 pm to 50 μm
Topography resolution	Vertical : 0.1 nm   Lateral1 : from 400nm to 8.5μm
Excitation frequency	from static to 25 Mhz
Laser pulse length	down to 7.5 ns
Max vertical velocity2	up to 10 m/s

1. equivalent to vibrometer spot size, objective dependent

2. specification does not depend on excitation frequency